Housings_DFN_QFN:QFN-28-1EP_5x5mm_Pitch0.5mm has oval pads
Housings_DFN_QFN:QFN-24-1EP_4x4mm_Pitch0.5mm has rectangular pads
Probably more, I noticed it here.

IMO there is no reason to have different pad shapes for same type of package.

(I like how OrCAD sources pad shapes externally. Maybe KiCAD will implement it in future library format...)

I need a 0.5mm pitch version of the DFN-12-1EP_3x3mm but there is just the 0.45mm version in the repo.

I'm happy to add as an individual item, or update the source script (if these footprints were script generated).

@SchrodingersGat I note that you made some updates a few months ago - was that by script?

I dont recognize this type of nomenclature from the industry
why not just DFN_QFN ?

Were these footprints machine created?

Especially with the smaller devices (e.g. DFN-10), the silkscreen looks really strange, pretty ugly, asymmetric...

I need a 3x3mm QFN24 package for the Inventsense MPU-9250 chip.

Can this be added, or can you point to the script that created these so I can add one myself?

Thanks.

Are the thermal pads meant to be split into multiple sub-pads?
Or could I submit a fix for this?